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Welcome Message

  • Welcome to the official website of 2023 International Computing, Programming and Algorithms Conference. 
  • Computing, Programming and Algorithms have revolutionised nearly every facet of modern life in the past decades, from healthcare to education, manufacturing to transport, and entertainment to agriculture. The design, implementation and evaluation of algorithms, computing and systems for combinatorial optimization problems foster the cooperation among researchers in computer science, networking, mathematical programming, operations researches, etc.
  • Organized by Hubei Zhongke Institute of Geology and Environment Technology and American Society for Science and Technology, 2023 International Computing, Programming and Algorithms Conference (CPA 2023) will be held on Sep. 28th-30th, 2023 in Beijing, China.

  • Aiming at bringing together innovative academicians and industrial experts in the field of artificial intelligence and computer science to a common forum, CPA tries to provide an academic platform on the communication of latest research and developmental activities in related areas and promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world.

  • During the conference, there will be substantial time for presentations and discussions. In addition, poster sessions and exhibitions offer valuable opportunity for exchanging information among delegates and participants, especially for those who are looking for new opportunities between presenters and participants.

  • Committee of CPA 2023 continues to make an effort to hold CPA conference successfully by working with the best editors and reviewer teams.

  • We look forward to seeing you at the Conference and also your contributions (abstracts and full papers are both welcome.).


  • Conference Organizer
  • Hubei Zhongke Institute of Geology and Environment Technology

Publication

  • Accepted full papers will be published as conference proceeding and submitted to EI Compendex and SCOPUS, etc.
  • Accepted abstracts (with no further full paper submission) will only be presenters (oral/poster) during the conference; no further publication will be proceeded. Full papers can be submitted after abstracts.  

Peer Review

  • Each submitted abstract/paper will be incorporated with a rigorous double-blind review process by at least two competent reviewers.

Important Dates

  • Conference Date:
  • Sep. 28th-30th, 2023
  • [Final Round] Abstract Submission DDL:
  • July 15, 2022
  • [Final Round] Full Paper Submission DDL:
  • July 15, 2022

Contact

Submission

  • All abstracts/papers should be submitted through CPA's official submission system at

Submission

Review

  • Please log into the official review system as reviewer for paper reviewing at

Review

Publication

Accepted papers by CPA 2023 will be published as conference proceeding and submitted to be indexed in EI Compendex, SCOPUS, etc.


Selected excellent papers will be published by the following SCI journals:

1. Special Issue "AI-Based Image Processing" with Applied Sciences (ISSN 2076-3417), SCI-indexed, IF 2.679

Topics include:

Image processing algorithms;

Image analytics;

Medial image processing;

Biomedical image analysis;

Image generation;

Image restoration and enhancement;

Image compression;

Edge detection;

Image segmentation;

Semantic segmentation;

Image classification;

Image inpainting;

Image captioning;

Feature detection and extraction;

Content-based image retrieval;

Optical character recognition;

Face recognition;

Emotion recognition;

Gesture recognition;

Object recognition and tracking.

Detailed information can be found at https://www.mdpi.com/journal/applsci/special_issues/AI_Based_Image.


2. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576

Topics include:

cost (of node, energy consumption, maintenance);

energy (self-powered sensors, stability, environmental protection);

communication (security, scalability);

data processing (distributed, big data, robustness);

WSNs design and validation;

Artificial intelligence in WSNs;

Industrial WSNs;

Body Sensor Networks;

Flexible sensors;

Novel sensor device for WSNs.

Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.


3. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847

Topics include:

Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;

2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;

Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;

Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.

Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.