Accepted papers by CPA 2023 will be published as conference proceeding and submitted to be indexed in EI Compendex, SCOPUS, etc.

Selected excellent papers will be published by the following SCI journals:

1. Special Issue "AI-Based Image Processing" with Applied Sciences (ISSN 2076-3417), SCI-indexed, IF 2.679

Topics include:

Image processing algorithms;

Image analytics;

Medial image processing;

Biomedical image analysis;

Image generation;

Image restoration and enhancement;

Image compression;

Edge detection;

Image segmentation;

Semantic segmentation;

Image classification;

Image inpainting;

Image captioning;

Feature detection and extraction;

Content-based image retrieval;

Optical character recognition;

Face recognition;

Emotion recognition;

Gesture recognition;

Object recognition and tracking.

Detailed information can be found at https://www.mdpi.com/journal/applsci/special_issues/AI_Based_Image.

2. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576

Topics include:

cost (of node, energy consumption, maintenance);

energy (self-powered sensors, stability, environmental protection);

communication (security, scalability);

data processing (distributed, big data, robustness);

WSNs design and validation;

Artificial intelligence in WSNs;

Industrial WSNs;

Body Sensor Networks;

Flexible sensors;

Novel sensor device for WSNs.

Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.

3. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847

Topics include:

Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;

2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;

Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;

Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.

Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.